Vienna, Vienna, Austria
• Strong foundation in semiconductor technology from ETH Zürich • 18 years of experience in digital IC and semiconductor design • Lead architect for highly complex systems spanning ICs/ASICs, FPGAs, MCUs, IPs, GPU clusters, and embedded/software platforms Highlights: ‣ Multi-Tbit/s low-power data-path – from GPU-cluster to ASIC ‣ Multi-gigabit SerDes IP integration ‣ Time synchronization protocol achieving system-wide synchronicity down to nanoseconds ‣ Parallel sorting algorithm in silicon ‣ Circuit-level algorithm implementation ‣ Full-reticle digital IC design, CMOS circuits on thin post-processed membrane ‣ Python software for custom-routing in ultra power-optimized areas ‣ Large on-chip memory with built-in self-test • Deep expertise in RTL-to-GDS flows, SystemVerilog, hardware-software co-design, verification, IP development and integration, testing, embedded systems, software development, and electronics • Proven track record improving design methodologies, verification flows, design robustness, and release quality • Effective technical leader and mentor with strong cross-functional collaboration and communication skills
• Director of department “Electronics and MEMS R&D” (2 management levels, 44 heads) • Technical responsibility over all department projects ‣ Technical review of digital IC design, FGPA firmware, embedded system design ‣ Review of development of MEMS post-process (Micro Electro-Mechanical System), and subsystem assembly
• Technical lead and architect for digital IC/ASIC designs (projects resourced with 5-8 engineers) • Architect, technical reviewer, mentor, hands-on implementer (SystemVerilog) • Rescued an inherited digital IC project by introducing a new architecture to achieve timing closure, tape-out in 28nm node • Introduced automated data exchange with design partners to shorten turn-around time and eliminate human errors
• Director of department “R&D Datapath and Control Systems” (1 management level, 35 heads) • Technical responsibility over all department projects ‣ Digital design (IC/FPGA/embedded systems) ‣ High-performance computing (HPC) ‣ Software development
• MEMS integration of piezoelectric nano‑wires • Development and realization of a fabrication process (chemical vapor deposition, lift‑off) • Lab work, analysis using AFM and electron microscope imaging
• Software development of EDA tools for low power digital design
• Co‑Founder of software company; buyout in 2002 • Software development (web front‑/back‑end, databases, desktop applications)