Berlin Metropolitan Area
Mechanical microsensors are increasingly important in diverse application areas such as automotive, entertainment and industry, especially due to their form factor and attractive manufacturing costs. Our group offers complete sensor development - from specifications, concept and manufacturing of sensor elements to packaging and testing.
My focus of work are Microelectromechanical Sensors (MEMS) like Pressure Sensors, Acceleration Sensors and Force Sensors, espacially for harsh envirorment using SiC and SOI material. Linked with my Plasma Etching activities I also work on Through Silicon Vias (TSV) and its passiviaton using thermal Oxidation, LPCVD, PECVD and Polymers.
This collaborative research project between Fraunhofer Institute IZM, Berlin, Germany and Griffith University, Queensland, Australia aims to: • Develop a high quality material system based on 3C-Silicon Carbide films on Insulator substrates (3SiCOI) for electronics and sensing applications at high temperatures. • Investigate sensing effects (e.g. thermoresistive and piezoresistive effect) of the 3C-SiC and demonstrate their applications (pressure-and temperature) for plastic extrusion monitoring. • Create the base for a competitive SiC technology for harsh environment Micro/Nano Electro Mechanical Systems (MEMS/NEMS).
Internationales Graduiertenkolleg "Materials and Concepts for Advanced Interconnects and Nanosystems"
Forschungsschwerpunkt Technologien der Mikroperipherik MEMS - Pressure Sensors, Acceleration Sensor Plasma ätzen (RIE, DSE, ASE) und CVD Processe (LPCVD, PECVD)
FEM Simulation von MEMS Systemen Herstellung von MEMS Drucksensoren für Niederdruck und Hochdruck. Herstellung von uniaxialen MEMS Beschleunigungssensoren.
Software und Systemtest von embedded Bezahlsystemen. ZKA, DCPOS, EMV Zulassungen