Hanover, New Hampshire, United States
More than 15 years’ experience on power electronics, electrical machines, motor drive and servo control research and development, analog and digital circuit design, embedded system implementation. Familiar with TI C28x DSP/Micro-controller and the digital feedback loop controller, PWM control, serial communication, digital signal filter, fault handling and state machine. As a leading engineer of new products, support project management and planning, and coordinate with entire engineering staff including mechanical engineer, software engineer and technician to drive project success. Currently as a senior staff engineer, focusing on the design of Boost/PFC converter, DC/AC inverter, Flyback and Forward converters, magnetics and the digital control systems for industrial manufacturing equipment.
Power Electronics Engineer/Embedded Firmware Engineer • Responsible for power topology research and evaluation, power components sizing, PWM control and magnetics design to meet the product development specifications; • Familiar with analog/digital circuit design, simulation and PCB layout software tools (Altium, Orcad Capture and Pspice); • Responsible for power circuit design and test including Flyback, Forward, Boost and Inverter Converters; • Familiar with the EMI/EMC test and HiPot test for switching power supplies to meet with industrial standards and safety regulation; • Investigating the application of wide band gap power devices (SiC&GaN) and novel power technologies to increase the switching frequency, reduce magnetics size/weight, and improve the efficiency. • Responsible for real-time digital control system design for PFC/Boost Converter and Half Bridge Inverter using TI C28x DSP with C/Assembly language; • DSP based embedded software development which including system self-diagnostic function, fault handling and state machine; • Working with process engineers to optimize the control parameters (PID, Sequence Timing) to optimize process performance; • Investigating the application of modern control theory on the digital control system to enhance the power factor, output stability and bus voltage regulation and robustness;
• Developed digital PID controlled linear servo system with position, velocity and current feedback using DSP for semiconductor IC packaging equipment (Wire Bonder and Die Bonder); • Performed electro-mechanical system modeling using MATLAB/SIMULINK, and bode plot/spectrum analysis for high speed and high precision motion control application; • Participated in full system design cycle from requirements/specifications to release to production; • Familiar with high sensitive optical encoders, current/voltage sensors and their drive electronics.
• Performed modeled based servo controller design for XYZ stage motion system in semiconductor IC assembly & packaging equipment (Wire Bonder); • Performed system identification of electro-mechanical motion system in frequency domain using bode plot and spectrum analysis; • Performed high order motion profile design, feed forward control loop auto-tuning and system calibration to improve tracking performance.