Microdul AG

Customized Microelectronics – Modules for Medtech and Industry, ASIC-Design, Manufacturing of Thick Film Substrates

Computers and Electronics Manufacturing · Zürich

About

Microdul is a Swiss high-tech company that was founded in 1991 as an MBO from Phillips Semiconductors in Zurich and has advanced to a dedicated partner for today’s top-class microelectronics. The company manufactures sophisticated electronic modules for medical devices, implants (AIMD), and high-end industrial products. The expertise of the experienced EMS supplier (electronics manufacturing services) lies in miniaturization, SMD assembly, BGA assembly, and advanced bare die packaging. In-depth expertise lies in wire bonding, die bonding, flip chip, chip-on-chip, chip-on-board, chip-on-ceramic, micro welding, customized bonding processes, and PCB potting. At the same time, the Swiss supplier is a proven one-stop shop for ASIC design (70 projects realized) with a comprehensive portfolio including development, validation, and wafer testing. In addition, it produces multi-layer thick-film substrates for harsh environments and implants. With its know-how extending down to the silicon die level, Microdul covers every step along the process chain: from engineering and manufacturing to testing of tailored solutions such as miniaturized PCBA for complex applications. Customers benefit from its long-term experience, which is being applied to get the most out of their innovations—including full implementation support. Medtech Passion for over Three Decades: Outstanding microelectronics by Microdul inspire renowned manufacturers around the world by paving the way for smaller and more complex medical devices and implants. Every day, more than half a million people benefit from its miniaturized circuits, which are the centerpiece of 15 AIMDs.

Details

  • Website: http://www.microdul.com
  • Founded: 1991
  • Company Size: 64 employees
  • Headquarters: Zürich
  • Specialties: ASIC, Implantable Devices, ISO13485, Electronic Implants, Contract Manufacturer, Class I, II, III medical devices, Microsystem Technologies, Temperature Sensing, Capacitive Sensors, Wirebonding, FlipChip, ASICdesign, ASIC Design, Medical Microelectronics, AIMD electronics, Ultra-low Power, Capacitive Switches, Mixed-Signal ASICs , Miniaturized Modules, Customized Electronics, Medical Device Electronics, Class 3 AIMDs, Class 3 Implants, Micromodules for Medical Implants , Medical Electronics, Multilayer Thick Film Substrates , Semiconductors, Dynamic Touch Sensors, Packaging, Glob Top, ASIC Services, Wafer Testing, Neurostimulation ASIC, Chip Stacking, Wirebonding, SMD Assembly, Ceramic Circuit Boards, Substrates for Harsh Conditions , Fine-Line Screen Printing, Via Technology, Laser-Trimmed Resistors, Multiple Resistance Printing, Circuit Boards, Miniaturization, Module Assembly, Ultra-Low-Power Sensors, Electronic Temperature Monitoring, Module Production, Microelectronics Production for Medical, Ultra-Low Power Modules, Active Implantable Medical Devices