ASMPT Ltd

Enabling the Digital World

Semiconductor Manufacturing · Singapore

About

Since our founding in 1975, ASMPT has continuously evolved and transformed itself through sustained growth, driven by innovation and strategic acquisitions – from equipment specialist to a leader in end-to-end solutions for electronics manufacturing, from more regionally-focused, to a global organisation, from more portfolio-driven to an increasingly integrated organisation realising the intelligent factories of the future. Our Mission Together – We have the POWER and agility to drive changes We deliver the highest value and innovative solutions to our customers through products and solutions with advanced technologies and excellent quality. Our POWER Values Passion to be the #1 “Go to Partner” Ownership of actions and behaviors Win with our customers Excellence in all that we do Respect for one and all ASMPT is a global company with presence in 30 countries with over 9,000 employees worldwide. We have a vast network of offices throughout Asia Pacific, Europe, and the USA to deliver global reach with a local touch. We believe our customers’ success is our success.

Details

  • Website: https://www.asmpt.com/
  • Founded: 1975
  • Company Size: 1774 employees
  • Headquarters: Singapore, Singapore
  • Specialties: Semiconductor Assembly Equipment, Semiconductor Packaging Equipment, Electronics Manufacturing, Thermo-Compression Bonding, Hybrid Bonding, Chip-to-Board Solutions, System-in-Package SiP, Chip-to-Wafer (C2W) Bonding, Chip-to-Substrate (C2S) Bonding, Solder Paste Printing, Photonics & Co-Packaged Optics, AI & HPC Chip Packaging, Automotive Electronics Manufacturing, Smart Manufacturing , Manufacturing Execution Systems (MES), Factory Automation , AI, High-Performance Computing, Surface Mount Technology (SMT), Advanced Packaging, Die Attach & Flip-Chip Bonding, Wafer Dicing & Laser Separation, Smart Manufacturing, SMT Printing, SMT Placement, Wafer Dicing & Laser Separation